Thermal simulations in microelectronics (3D)

Personnes :

• Prof. dr.  DE MEY Gilbert - Universiteit Gent (UGent)
  Partenaire financé belge
  Durée: 1/9/1990-31/8/1994
  

Description :

The proposed topics are :

3D thermal simulations of IC packages.
Natural convection cooling of semiconductor surfaces.
Electrothermal simulation of electric and electronic networks.
Electrothermal simulation of semiconductor components.
Flow calculations in racks and subracks.
Simulation of ferroelectric liquid crystals.
Simulation of electric current distribution during electrotherapy.